Saturn Electronics Corporation, Multilayer PCB Fabrication Manufacturer, provides high reliability and uniform wiring in order to meet the demands of our customers. In order to establish highly reliable and deliberate interconnection of electronic circuits, Multilayer PCBs are fabricated with several layers placed over each individual layer.
In order to reduce process steps, multilayer PCBs are drilled, plated, and then laminated. Interconnection between the layers is vital. As a result, multilayers are a core product. Multilayer Circuit Board functionality serves as the real estate for the end product and thus Saturn ensures that it makes a significant contribution to the OEM by being meticulous about microvias and high density interconnections or HDI.
Multilayer Registration
Layer-to-Layer Alignment
One primary characteristic is layer to layer alignment. In addition to our MultiLine tooling systems, we have purchased and implemented the use of the PerfecTest system to fine tune our process and achieve highly accurate scale factor predictions for a variety of material types and core thicknesses.
Multi-layer Imaging
Saturn has purchased and installed four Olec AT-30 automatic alignment exposure units. These units use four cameras to align artwork top to bottom, and then use panel motion systems to automatically adjust the panel position to a best fit to the artwork. Furthermore, these units have hybrid-collimated light units that ensure exposure light attacks the panel at 90 degree angles to the artwork, which is critical for fine line resolutions.
Standard: Saturn uses MultiLine equipped drawers for imaging. MultiLine tooling removes the human factor involved in lining up the bottom film to the top film. This results in significantly reduced off-registration issues.
Advanced (inner layers): Saturn also employs the use of an Olec AX-28 automatic exposure unit that uses two cameras to align the top and bottom artwork. This machine can hold registration as tight as +/- .0005 mils front to back for inner layers.
Industry-Leading (inner and outer layers):Saturn has purchased and installed two Olec AT-30 automatic alignment exposure units. These units use four cameras to align artwork top to bottom, and then use panel motion systems to automatically adjust the panel position to a best fit to the artwork. Furthermore, these units have hybrid-collimated light units that ensure exposure light attacks the panel at 90 degree angles to the artwork, which is critical for fine line resolutions.
PCB Drilling
Microvia Formation CapabilitiesWe have installed advanced drilling systems (Excellon Century 2001 and Mania Micronics 86) capable of up to 180k RPM spindle speed, which is critical for microvia formation. Furthermore, our advanced systems use linear motion technology for X, Y, and Z axis motion. This results in not only a higher throughput, but also increased registration accuracy.
Saturn’s lowest-end PCB drilling machines are Excellon Mark VI CNC drillers. All of these machines are equipped with automatic measurement systems that measure drill bit length, diameter, spindle runout, and broken drill bit detection.
Essentially, these capabilities remove the human element from these drilling issues, thereby minimizing the chance of operator error.
Saturn also has three Mania Micronics 86 drilling machines. These machines incorporate the industry’s latest linear motion technology and 180k RPM high speed spindles. The use of linear motion increases hole position accuracy from an industry standard of +/- 0.002” down to +/- 0.0005”, including in the Z-axis, which makes these ideal for controlled depth blind via drilling.
Production Plating
Standard Production and Blind Microvias
Saturn has built a custom automatic plating line that has been designed and constructed primarily in-house. The intent was to minimize plating variation, which is the main goal of production plating. To address issues with plating small and blind holes we use mechanical agitation to allow chemical to flow through holes and vibration to remove air from microvias and blind microvias.2 Mil Line and Spacing
Saturn has installed a new Hollmuller SES line. This line incorporates the latest in spray technology that minimizes chemical puddling. This is line capable to accurately and uniformly etch down to 2 mil lines and spaces.
Saturn employs two automatic electroplating lines and, as such, PTH is a two-step process. Saturn has built a custom automatic plating line that has been designed and constructed primarily in-house. The intent was to minimize plating variation, which is the main goal of production plating. This was accomplished by including the following:
1. It houses racks that only allow panels to be plated one-high.
2. Anode-to-anode distance is 28 inches (maximum allowable distance for plating).
3. Water-submerged positive cathode contact.
4. Chemical-submerged anode bars for positive contact.
5. Eductor system. This utilizes a highvolume chemical flow parallel to the panels instead of air to accomplish chemical agitation.
6. Mechanical agitation to allow chemical to flow through holes.
7. Vibration to remove air from microvias andblind microvias. 8. Dual-sided rectification to equalize copper plating from one side of the rack to the other.
9.State-of-the-art rectifiers (two per rack) with 0.5% maximum ripple effect.
10. Panels are now being plated at 15 amps per square feet (ASF), versus an industry standard of 45 ASF. This will result in more uniform plating, albeit lowered production.
11. High ductile plating process that meets C7000 specs for 1,000 hour cycle tests.
12. Chemistry has been revised so that high-aspect ratio plating can be performed. Both lines are calibrated to plate 10:1 aspect ratio as a standard.
Multilayer PCB Prototypes
Production Quality Multi-layer Boards
Saturn builds complex quick turn prototypes to production standards per IPC Class III and high reliability testing.
DeBurrer for MicroviasAddressing the industry demand for multilayer boards and microvias, Saturn installed the Ishii Hyoki DeBurrer ICN4-700 into its Romulus-based PCB fabrication facility last week. The ICN4-700 is essential for the polishing process in the manufacture of printed circuit boards. The new DeBurrer not only increases Saturn’s advanced technology capabilities for PCBs but it also improves quality and reliability while increasing PCB production capacity.
The Ishii Hyoki PCB Manufacturing Deburrer is equipped with an ultra sonic chamber specifically designed for effectively cleaning microvias. The new Deburrer increases quality by automatically measuring panel thickness and adjusting brush pressure accordingly. The result is that Saturn’s deburring process is completely independent of manual operation during bare board fabrication.
"This New Addition to our process adds a critical capability to insure production capabilites of advanced technologies"
Yash Sutariya
2 comments:
Thanks for such an informative article and the extensive explanation, it's been very useful.
pcb assembly
It is seen that the multilayered PCB”s have become an important part of the technology now and it is used in the mobility as well besides the complex development of it, it is good to know that these multilayered PCB’s are very important.
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